? semiconductor components industries, llc, 2006 august, 2016 ? rev. 8 1 publication order number: mc10h123/d mc10h123 triple 4\3\3\input bus driver description the mc10h123 is a triple 4-3-3-input bus driver. the mc10h123 consists of three nor gates designed for bus driving applications on card or between cards. output low logic levels are specified with v ol = ? 2.1 vdc so that the bus may be terminated to ? 2.0 vdc. the gate output, when low, appears as a high impedance to the bus, because the output emitter-followers of the mc10h123 are ?turned-off.? this eliminates discontinuities in the characteristic impedance of the bus. the v oh level is specified when driving a 25 load terminated to ? 2.0 vdc, the equivalent of a 50 bus terminated at both ends. although 25 is the lowest characteristic impedance that can be driven by the mc10h123, higher impedance values may be used with this part. a typical 50 bus is shown in figure 3. features ? propagation delay, 1.5 ns typical ? improved noise margin 150 mv (over operating voltage and temperature range) ? voltage compensated ? mecl 10k ? compatible ? these devices are pb-free, halogen free and are rohs compliant www.onsemi.com *for additional marking information, refer to application note and8002/d . a = assembly location wl, l = wafer lot yy, y = year ww, w = work week g = pb-free package marking diagrams* pdip ? 16 p suffix case 648 ? 08 16 1 16 1 mc10h123p awlyywwg pllc ? 20 fn suffix case 775 ? 02 20 1 10h123g awlyyww 120 pdip ? 16 pllc ? 20 ordering information device package shipping ? MC10H123FNR2G 500 tape & reel mc10h123fng pllc ? 20 (pb-free) 46 units / tube mc10h123pg pdip ? 16 (pb-free) 25 units / tube pllc ? 20 (pb-free) ?for information on tape and reel specifications, in- cluding part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d .
mc10h123 www.onsemi.com 2 figure 1. logic diagram figure 2. dip pin assignment v cc1 b out a out a in a in a in a in v ee v cc2 c out c in c in c in b in b in b in 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 v cc1 = pin 1 v cc2 = pin 16 v ee = pin 8 3 5 6 7 4 2 9 10 11 15 12 13 14 pin assignment is for dual-in-line package. table 1. maximum ratings symbol characteristic rating unit v ee power supply (v cc = 0) ? 8.0 to 0 vdc v i input voltage (v cc = 0) 0 to v ee vdc i out output current continuous surge 50 100 ma t a operating temperature range 0 to +75 c t stg storage temperature range plastic ceramic ? 55 to +150 ? 55 to +165 c c stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device function ality should not be assumed, damage may occur and reliability may be affected. table 2. electrical characteristics (v ee = ? 5.2 v 5%) (note 1) 0 25 75 symbol characteristic min max min max min max unit i e power supply current 60 56 60 ma i inh input current high 495 310 310 a i inl input current low 0.5 0.5 0.3 a v oh high output voltage ? 1.02 ? 0.84 ? 0.98 ? 0.81 ? 0.92 ? 0.735 vdc v ol low output voltage ? 2.1 ? 2.03 ? 2.1 ? 2.03 ? 2.1 ? 2.03 vdc v ih high input voltage ? 1.17 ? 0.84 ? 1.13 ? 0.81 ? 1.07 ? 0.735 vdc v il low input voltage ? 1.95 ? 1.48 ? 1.95 ? 1.48 ? 1.95 ? 1.45 vdc 1. each mecl 10h ? series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. the circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 lfpm is maintained. outputs are terminated through a 50 resistor to ? 2.1 v.
mc10h123 www.onsemi.com 3 table 3. ac characteristics 0 25 75 symbol characteristic min max min max min max unit t pd propagation delay 0.7 1.5 0.7 1.6 0.7 1.7 ns t r rise time 0.7 1.6 0.7 1.7 0.7 1.8 ns t f fall time 0.7 1.6 0.7 1.7 0.7 1.8 ns note: device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printe d circuit board with maintained transverse airflow greater than 500 lfpm. electrical parameters are guaranteed only over the declared operating temperature range. functional operation of the device exceeding these conditions is not implied. device specification limit values are applied individually under normal operating conditions and not valid simultaneously. figure 3. 50 bus driver (25 load) 1/3 mc10h123 1/3 mc10h123 1/3 mc10h123 z o = 50 ? 2.0 vdc receivers (mecl gates) ? 2.0 vdc 50 50
mc10h123 www.onsemi.com 4 package dimensions 20 lead pllc fn suffix case 775 ? 02 issue f ? m ? ? n ? ? l ? y brk w v d d s l-m m 0.007 (0.180) n s t s l-m m 0.007 (0.180) n s t s l-m s 0.010 (0.250) n s t x g1 b u z view d ? d 20 1 s l-m m 0.007 (0.180) n s t s l-m m 0.007 (0.180) n s t s l-m s 0.010 (0.250) n s t c g view s e j r z a 0.004 (0.100) ? t ? seating plane s l-m m 0.007 (0.180) n s t s l-m m 0.007 (0.180) n s t h view s k k1 f g1 notes: 1. dimensions and tolerancing per ansi y14.5m, 1982. 2. dimensions in inches. 3. datums ? l ? , ? m ? , and ? n ? determined where top of lead shoulder exits plastic body at mold parting line. 4. dimension g1, true position to be measured at datum ? t ? , seating plane. 5. dimensions r and u do not include mold flash. allowable mold flash is 0.010 (0.250) per side. 6. dimensions in the package top may be smaller than the package bottom by up to 0.012 (0.300). dimensions r and u are determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch between the top and bottom of the plastic body. 7. dimension h does not include dambar protrusion or intrusion. the dambar protrusion(s) shall not cause the h dimension to be greater than 0.037 (0.940). the dambar intrusion(s) shall not cause the h dimension to be smaller than 0.025 (0.635). dim min max min max millimeters inches a 0.385 0.395 9.78 10.03 b 0.385 0.395 9.78 10.03 c 0.165 0.180 4.20 4.57 e 0.090 0.110 2.29 2.79 f 0.013 0.021 0.33 0.53 g 0.050 bsc 1.27 bsc h 0.026 0.032 0.66 0.81 j 0.020 ??? 0.51 ??? k 0.025 ??? 0.64 ??? r 0.350 0.356 8.89 9.04 u 0.350 0.356 8.89 9.04 v 0.042 0.048 1.07 1.21 w 0.042 0.048 1.07 1.21 x 0.042 0.056 1.07 1.42 y ??? 0.020 ??? 0.50 z 2 10 2 10 g1 0.310 0.330 7.88 8.38 k1 0.040 ??? 1.02 ???
mc10h123 www.onsemi.com 5 package dimensions pdip ? 16 p suffix case 648 ? 08 issue v style 1: pin 1. cathode 2. cathode 3. cathode 4. cathode 5. cathode 6. cathode 7. cathode 8. cathode 9. anode 10. anode 11. anode 12. anode 13. anode 14. anode 15. anode 16. anode style 2: pin 1. common drain 2. common drain 3. common drain 4. common drain 5. common drain 6. common drain 7. common drain 8. common drain 9. gate 10. source 11. gate 12. source 13. gate 14. source 15. gate 16. source 18 16 9 b2 note 8 d a top view e1 b b l a1 a c seating plane 0.010 ca side view m 16x d1 e a2 note 3 m b m eb e end view end view with leads constrained dim min max inches a ???? 0.210 a1 0.015 ???? b 0.014 0.022 c 0.008 0.014 d 0.735 0.775 d1 0.005 ???? e 0.100 bsc e 0.300 0.325 m ???? 10 ??? 5.33 0.38 ??? 0.35 0.56 0.20 0.36 18.67 19.69 0.13 ??? 2.54 bsc 7.62 8.26 ??? 10 min max millimeters notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: inches. 3. dimensions a, a1 and l are measured with the pack- age seated in jedec seating plane gauge gs ? 3. 4. dimensions d, d1 and e1 do not include mold flash or protrusions. mold flash or protrusions are not to exceed 0.10 inch. 5. dimension e is measured at a point 0.015 below datum plane h with the leads constrained perpendicular to datum c. 6. dimension eb is measured at the lead tips with the leads unconstrained. 7. datum plane h is coincident with the bottom of the leads, where the leads exit the body. 8. package contour is optional (rounded or square corners). e1 0.240 0.280 6.10 7.11 b2 eb ???? 0.430 ??? 10.92 0.060 typ 1.52 typ c a2 0.115 0.195 2.92 4.95 l 0.115 0.150 2.92 3.81 h note 5 note 6 m e/2 on semiconductor and are trademarks of semiconductor components industries, llc dba on semiconductor or its subsidiaries i n the united states and/or other countries. on semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property . a listing of on semiconductor?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent ? marking.pdf . on semiconductor reserves the right to make changes without further notice to any products herein. on semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does o n semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. buyer is responsible for its products and applications using on semiconductor products, including compliance with all laws, reg ulations and safety requirements or standards, regardless of any support or applications information provided by on semiconductor. ?typical? parameters which may be provided in on semiconductor data sheets and/or specifications can and do vary in dif ferent applications and actual performance may vary over time. all operating parameters, including ?typic als? must be validated for each customer application by customer?s technical experts. on semiconductor does not convey any license under its patent rights nor the right s of others. on semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any fda class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. should buyer purchase or use on semicondu ctor products for any such unintended or unauthorized application, buyer shall indemnify and hold on semiconductor and its officers, employees, subsidiaries, affiliates, and distrib utors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that on semiconductor was negligent regarding the design or manufacture of the part. on semiconductor is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 mc10h123/d literature fulfillment : literature distribution center for on semiconductor 19521 e. 32nd pkwy, aurora, colorado 80011 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative mecl is trademark of semiconductor components industries, llc (scillc) or its subsidiaries in the united states and/or other co untries.
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